About this call Funding information Xecs call 6 invites innovative RD&I proposals. Any proposal covering a topic from the Electronic Components and Systems-SRIA can be submitted. The technology domains addressed range from micro- and nanoelectronics, smart electronics system integration (e.g. chiplets) via embedded and cyber physical systems to complex system of systems integration. The call opens on 23 June 2026 and will close with the project outline submission deadline on 21 January 2027. Applicants can build international consortia with industry, SMEs, RTOs and academia. During a webinar on 23 June 2026, we’ll give you advice on “ How to Prepare and Make the Most of Xecs Matchmaking ”. The matchmaking event on 6 and 7 October 2026 in Vienna will give the opportunity to meet the ECS community and potential partners, present and listen to project ideas, SME pitches and learn more about the Eureka Cluster, Xecs and the supporting countries.…